As an international renowned DRAM module manufacturer emphasizing environmental protection, KINGMAX is the first one to adopt the nano thermal dissipation technology to perform overclocking DRAM module. KINGMAX successfully launched DDR3 Nano Gaming Ram module with excellent performance to replace the DRAM with conventional heat sink. Based on the nanoscale silicon coating, the nano thermal dissipation technology helps DDR3 Nano Gaming Ram lighter in volume and greater in thermal dissipation performance than conventional heat sink. Since the product is just available on the market, it gained high praise from the media and gamers from the Taiwan, Russia, Malaysia, Vietnam, Thailand and China regions etc. It won a Silver medal for authoritative media evaluation and the Innovative Technology Award. For gamers, DDR3 Nano Gaming Ram is the best product bringing overclocking enjoyment to them. After the launching of DDR3 Nano Gaming Ram, the new eco-friendly generation of DRAM module without heat sink has been declared.
The nano thermal dissipation technology reduces not only the materials for making traditional heat sink, but also the consumption of resources and carbon footprint. In other words, the nano thermal dissipation technology can replace conventional heat sink, as though it was an “invisible heat sink”. Furthermore, during the manufacturing process of the DDR3 Nano Gaming Ram, KINGMAX used a lead-free production process that achieving KINGMAX’s eco-friendly goal, and fulfilling the responsibility for a green environment. DDR3 Nano Gaming Ram with nano thermal dissipation technology was evaluated by the media and gamers, and they witnessed without heat sink, DRAM module still has excellent performance.
KINGMAX, global memory technology leader, upholds the belief in low carbon and environmental protection, and is the first one to apply the nano thermal dissipation technology to DRAM module. By adopting the nano-size thermal dissipation silicon compound
to increase the release of radiant heat, and remove the IC surface heat more quickly, nano thermal dissipation technology gets rid of heavy heat sink to improve air flow inside the case. According to the test results of KINGMAX lab, the working temperature
of modules with conventional heat sink is about 45-50°C, modules with nano thermal dissipation technology is only about 39±1°C while operating overclocking. As indicated in the test report, thenano thermal dissipation technology can effectively improve thermal
performance by 10%.
As thermal dissipation performance is one of the key factors to optimal operating efficiency, data processing speed and system stability for DRAM module, it is not only one of the main concerns for overclocking players but also the technical issue in the pursuit
of Innovative leadership for every module manufacturer. At present, most module makers improve thermal performance by adding bulky heat sinks, but this way results in increasing the manufacturing cost and consuming more resources on earth indirectly.
Features of KINGMAX DDR3 Nano Gaming Ram2200:
- Support Intel P55 Chipset
- Adopting Nano Thermal Dissipation Technology
- ASIC chip embedded for anti-counterfeiting purpose
- Lead-free production process
- Tiny BGATMtechnology adopted: with advantages as compact size, well heat dissipation and low EM interference
- 100% product compatibility and stability
- High data transfer performance for overclocking enthusiasts and hardcore gamers
Specification of KINGMAX DDR3 Nano Gaming Ram2200:
- 240-pin DDR3 2200MHz
- CAS Latency: 10
- Bandwidth: 17.6GB/sec
- Voltage: 1.5~1.8v
- Capacity: 4GB (2GB*2)
- Worldwide lifetime warranty