Since ex-US Vice President Gore in the documentary An Inconvenient Truth (2006), called for environmental protection, energy saving and carbon reduction, and green energy life has gradually transformed from a mere slogan into reality. From common life to high-tech industries, low-carbon and environmental life has become a common goal. As an internationally renowned DRAM module maker emphasizing environmental protection, KINGMAX is the first module manufacturer implementing nano thermal dissipation technology to OC DRAM module and has successfully launched the high-performance DDR3 Nano Gaming Ram with nano thermal dissipation technology this year. Apart from pioneering a new trend of thermal solution for DRAM module, KINGMAX has realized the corporate social responsibility for low carbon products, environmental protection and social benefits.
As thermal performance is the key to optimal computing efficiency, data processing speed and system stability for DRAM module, it is not only one of the main concerns for OC users but also the technical issue in the pursuit of Innovative leadership for every module manufacturer. At present, most module makers improve thermal performance by adding bulky heat sinks, but this way results in increasing the manufacturing cost and consuming more resources on earth indirectly.
KINGMAX, global memory technology leader, upholds the belief in low carbon and environmental protection, and is the first one to apply the nano thermal dissipation technology to OC DRAM module. By adopting the nano-size thermal dissipation silicon compound to increase the release of radiant heat, and remove the IC surface heat more quickly, nano thermal dissipation technology gets rid of heavy heat sink to improve air flow inside the case. As shown from KINGMAX lab test results, the working temperature of modules with traditional heat sink is about 45-50°C in OC operations, while it is only about 39±1°C for modules with the nano thermal dissipation technology. As indicated in the test report, the nano thermal dissipation technology can effectively improve thermal performance by 9.5%.
In addition to enhancing heat radiation performance and improving air flow inside the case, nano thermal dissipation technology not only reduces the materials for making traditional heat sink, but also reduces carbon footprint and saves global resource.
In other words, nano thermal dissipation technology can replace conventional heat sink, as though it was an “invisible heat sink”. As the nano thermal dissipation technology is effective and efficient, KINGMAX has implemented this technology to all DDR3 Nano
Gaming Ram series products, particularly the DDR3 2200 MHz dual channel DRAM module with high-speed transfer bandwidth up to 17.6Gbps to meet gamers’ demands for extreme speed and the ultimate overclocking enjoyment.
Features of KINGMAX DDR3 Nano Gaming Ram
2200:
- Support Intel P55 Chipset
- Adopting Nano Thermal Dissipation Technology
- ASIC chip embedded for anti-counterfeiting purpose
- Lead-free production process
- Tiny BGATMtechnology adopted: with advantages as compact size, well heat dissipation and low EM interference
- 100% product compatibility and stability
- High data transfer performance for overclocking enthusiasts and hardcore gamers
Specification of KINGMAX DDR3 Nano Gaming Ram 2200:
- 240-pin DDR3 2200MHz
- CAS Latency: 10
- Bandwidth: 17.6GB/sec
- Voltage: 1.5~1.8v
- Capacity: 4GB (2GB*2)
- Worldwide lifetime warranty